Launch 3 Telecom provides straight down vertical pipe exothermic molds engineered for high-quality grounding and bonding connections in telecom, utility, and industrial installations. These molds ensure strong, permanent, low-resistance welds between grounding conductors and vertical pipe surfaces, delivering long-term electrical reliability in demanding environments. Built from premium, high-temperature materials, they offer consistent performance and repeatable weld integrity in field conditions.
Our inventory includes a range of molds designed for grounding electrodes, copper bonding conductors, vertical pipe terminations, pipe-to-wire exothermic welds, vertical ground rod connections, and telecom grounding grids. Compatible with standard exothermic welding systems, these molds support critical applications such as tower grounding, shelter bonding, utility grounding, lightning protection, equipment bonding, and RF system grounding. Each mold is precision-formed to deliver clean, controlled reactions and secure conductor alignment.
Straight down vertical pipe exothermic molds from Launch 3 Telecom are trusted across 5G sites, macro towers, DAS nodes, small cell installations, utility substations, commercial buildings, and industrial facilities. By creating permanent molecular bonds, they eliminate mechanical failure points and ensure stable grounding performance for decades. Whether you’re building new grounding networks or maintaining existing installations, Launch 3 Telecom provides dependable exothermic mold solutions to keep your infrastructure safe, compliant, and properly bonded.
